Chemical Mechanical Polishing Machine (CMP)

The KemCol 15 machine is ideal for Chemical Mechanical Polishing (CMP), and Cerium Oxide based polishing applications. The machine is based on the popular Kemet 15 lapping and polishing machine, but incorporates stainless steel elements in place of painted components for longer life, and contamination free polishing. It comes as standard with an integrated Kemet AkuDisp fully programmable peristaltic pump system, and either ceramic faced, or stainless steel conditioning rings. The Kemcol 15 system was initially developed as a super finishing process for the medical sector, but is also now used within the injection-moulding tool polishing industry, Sapphire polishing and many others. It is able to produce a scratch free mirror surface on Cobalt Chromes, Stainless Steels, Titanium and many other materials.

Special Features:

  • Stainless Steel worktable surrounding polishing pad
  • Polished Stainless Steel yokes for easier cleaning
  • Stainless Steel drive plate
  • Aluminium lift off disc system optional
  • Ceramic faced or stainless steel conditioning rings for contamination free polishing
  • AkuDisp fully programmable peristaltic pump unit fitted as standard
  • Suitable for Kemet magnetic polishing pad system for easy pad change

cmp polishing machine

Recommended Accessories & Consumables for the KemCol 15

Description Code
Set of 3 Ceramic Faced Conditioning Rings 361522
Stainless Steel Plastic Faced Conditioning Rings 362757
380 mm Stainless Steel Support Plate (For Polishing Pads) 362033
380 mm Aluminium Lift Off Disc 361001
380 mm Aluminium Drive Plate 361002
380 mm Thin Metal Disc (For use with magnetic system) 342563
380 mm Magnetic Disc 345773
CMP Slurry 5 litres 10 litres 20 litres
Col-K 600212 600238 600204
Col-K (NC) 600199 600239 600202
CMP polishing slurry
Recommended Consumables Code
380 mm CHEM-H Polyurethane Polishing Pad 341865
380 mm PSU-M Chemo-Textile Cloth for Cerium 341011
380 mm MRE Short Napped Final Polishing Pad 341715

CMP Process Case Study

The use of CMP has become increasingly popular in the manufacturing industry, and this case study demonstrates its effectiveness in achieving a high-quality finish on Aluminum samples while leaving no abrasive particles in the samples. The process involved two stages of polishing, with the second stage using CMP to achieve the final finish. The use of CMP is particularly important for achieving a high-quality finish without leaving any abrasive particles on the surface of the material. Overall, this case study highlights the importance of using the right tools and processes to achieve the desired finish on metal components.

Test Requirements:To produce best finish on Aluminium samples leaving no abrasive particles in the samples.
Component/Material: 4 off ½” x 2” Aluminium strips

The goal of this test was to produce the best finish on Aluminium samples while leaving no abrasive particles in the samples. The components used in the test were 4 off ½” x 2” Aluminium strips.

To achieve the desired finish on the Aluminium samples, two stages of polishing were used. The first stage involved using a Kemet 15 Lapping/Polishing machine with a cast iron lap plate and Kemox O-800S Aluminium oxide premixed slurry as the abrasive type and grade. This stage was aimed at removing the bulk of the material and levelling the surface. The second stage involved using a KemCol 15 machine with an MRE short nap cloth lap plate and Col-K (NC) CMP slurry as the abrasive type and grade. This stage was aimed at achieving the final high-quality finish on the Aluminium samples.

The use of CMP in the second stage is particularly important, as it uses a chemical action to polish the surface of the components in place of a conventional abrasive type polishing process. This means that there should not be any abrasive particles in the surface of the Aluminium, which is crucial for achieving the desired finish and maintaining the quality of the final product.

The polishing time for the entire process was 80 minutes using the setup that was available for the parts. After the process was completed, the Aluminium samples were inspected under a microscope, and it was found that the desired finish was achieved with no abrasive particles present on the surface. The surface finish was of a high quality, and the components were ready for use in the final product.

Resulting Ra from this process: Ra 1.647µinch

Process Breakdown
Stage Plate/cloth type Abrasive type/grade Process time
Lap Cast Iron Kemox O-800S 5 minutes
Polish MRE COL-K (NC) 80 minutes

Before CMP Process

Before Chemical Mechanical Polishing

After CMP Process

After Chemical Mechanical Polishing

Related Case Studies for Chemical Mechanical Polishing

What is Chemical Mechanical Polishing

Chemical Mechanical Polishing (CMP) is a method of surface polishing that has become increasingly popular in the manufacturing industry. CMP is a combination of chemical and mechanical forces that are applied to the surface of a material to polish it to a very high level of smoothness. This process is particularly useful for materials that are difficult to machine or have complex geometries.

CMP is a process that involves the use of a chemical slurry, a polishing pad, and a polishing head. The chemical slurry is made up of a mixture of abrasive particles, chemical additives, and a liquid carrier. The polishing pad is made of a soft material, such as polyurethane, and is attached to the polishing head. The process starts with the application of the chemical slurry onto the surface of the material. The polishing head then applies pressure to the polishing pad, which causes the abrasive particles to come into contact with the surface of the material. The chemical additives in the slurry react with the material, causing it to dissolve or react chemically, while the abrasive particles physically remove material from the surface. The combination of chemical and mechanical forces creates a polishing action that results in a smooth, even surface. The polishing pad also helps to distribute the slurry evenly across the surface of the material, ensuring that the entire surface is polished uniformly.

Applications of Chemical Mechanical Polishing:

CMP is commonly used in the manufacturing of microelectronic devices, such as computer chips and memory devices. These devices have complex geometries and require a high level of surface uniformity, which can be difficult to achieve using conventional polishing methods. CMP is also used in the manufacturing of optical components, such as lenses and mirrors. The process is particularly useful for producing high-quality surface finishes on glass and other brittle materials that are difficult to machine.

Advantages of Chemical Mechanical Polishing:

One of the main advantages of CMP is its ability to produce a high-quality surface finish on complex geometries and difficult-to-machine materials. The process is also very precise and can be used to achieve a high level of surface uniformity across large areas. CMP is also a relatively fast process compared to other surface polishing methods. This is because the chemical slurry and polishing pad work together to remove material from the surface of the material, resulting in a more efficient polishing process.

kemet ISO 9001

BSI number Q05919

Over 85 years of service to industry

Your subscription could not be saved. Please try again.

Signup to receive our special offers

Cookies & Privacy Policy | Kemet International Ltd. Subsidiaries
© 2023 Kemet International Limited is a company registered in England and Wales with company number 344017. VAT number GB202934881.

Cookie Notice

This site uses cookies to ensure the best experience. By continuing to use this website, you agree to their use. Learn more about our privacy policy.